Knut E. Aasmundtveit
Department of Micro and Nano Systems Technology
HiVe—Vestfold University College
Tønsberg, Norway
Alaa Abdellah
Institute for Nanoelectronics
Technische Universität München
Munich, Germany
Manoranjan Acharya
Intel Corp.
Hillsboro, Oregon
Zubair Ahmad
Low Dimensional Materials Research Center (LDMRC)
University of Malaya
Kuala Lumpur, Malaysia
Shunsuke Akimoto
Department of Electrical and Electronic Engineering
Tokyo University of Agriculture and Technology
Tokyo, Japan
Syed M. Alam
Everspin Technology
Chandler, Arizona
Edgar Albert
Institute for Nanoelectronics
Technische Universität München
Munich, Germany
Manuel Aldegunde
Electronics System Design Centre
Swansea University
Wales, United Kingdom
Paul Ampadu
Department of Electrical and Computer Engineering
University of Rochester
Rochester, New York
Sivaram Arepalli
Department of Energy Science
Sungkyunkwan University
Suwon, Korea
Adrianus I. Aria
Charyk Laboratory of Bioinspired Design
Graduate Aeronautical Laboratories
California Institute of Technology
Pasadena, California
Nabil Ashraf
School of Electrical, Computer and Energy Engineering
Arizona State University
Tempe, Arizona
Rehman Ashraf
Department of Electrical and Computer Engineering
Portland State University
Portland, Oregon
Abdullah Mohamed Asiri
Chemistry Department and the Center of Excellence for Advanced Materials Research
King Abdulaziz University
Jeddah, Saudi Arabia
Nivard Aymerich
Department of Electronic Engineering
Universitat Politècnica de Catalunya
Catalonia, Spain
Rock-Hyun Baek
POSTECH-Pohang
University of Science and Technology
Pohang, Republic of Korea
Alexander A. Balandin
Department of Electrical Engineering and Materials Science and Engineering Program
University of California
Riverside, California
Mario Bareiß
Institute for Nanoelectronics
Technische Universität München
Munich, Germany
Burhan Bayraktaroglu
Air Force Research Laboratory
Wright Patterson AFB, Ohio
Markus Becherer
Lehrstuhl für Technische Elektronik
Technische Universität München
Munich, Germany
C. I. M. Beenakker
Delft Institute of Microsystems and Nanoelectronics
Delft University of Technology
CT Delft, the Netherlands
Azam Beg
College of Information Technology
United Arab Emirates University
Al Ain, United Arab Emirates
Valeriu Beiu
College of Information Technology
United Arab Emirates University
Al Ain, United Arab Emirates
Paul L. Bergstrom
Department of Electrical and Computer Engineering
Michigan Technological University
Houghton, Michigan
G. H. Bernstein
Department of Electrical Engineering and Center for NanoScience and Technology
University of Notre Dame
Notre Dame, Indiana
N. Bhandari
School of Electronics and Computing Systems
University of Cincinnati
Cincinnati, Ohio
Sanjukta Bhanja
Department of Electrical Engineering
University of South Florida
Tampa, Florida
Anders Blom
QuantumWise A/S
Copenhagen, Denmark
U. Böttger
Peter Grünberg Institut
and
JARA Jülich-Aachen Research Alliance–Fundamentals for Future Information Technology
Jülich, Germany
Christina Brantley
U.S. Army
Redstone Arsenal, Alabama
Stephan Breitkreutz
Lehrstuhl für Technische Elektronik
Technische Universität München
Munich, Germany
R. Bruchhaus
Peter Grünberg Institut
and
JARA Jülich-Aachen Research Alliance–Fundamentals for Future Information Technology
Jülich, Germany
M. Cahay
School of Electronics and Computing Systems
University of Cincinnati
Cincinnati, Ohio
Kurtis D. Cantley
Department of Materials Science and Engineering
University of Texas at Dallas
Richardson, Texas
Parthasarathi Chakraborti
Packaging Research Center
Georgia Institute of Technology
Atlanta, Georgia
Mary B. Chan-Park
School of Chemical and Biomedical Engineering
Nanyang Technological University
Singapore
J. Charles
School of Electronics and Computing Systems
University of Cincinnati
Cincinnati, Ohio
Jamil Anwar Chaudry
Institute of Chemistry
University of the Punjab
Lahore, Pakistan
Daw Don Cheam
Institute of Microelectronics
Singapore
An Chen
Exploratory Research
Sunnyvale, California
C. C. Chen
Department of Materials Science and Engineering
National Chiao Tung University
Hsinchu, Taiwan
Hongzhi Chen
Department of Electrical and Computer Engineering
Michigan State University
East Lansing, Michigan
In-Gann Chen
Center for Micro/Nano Science and Technology
National Cheng Kung University
Tainan, Taiwan
Liangliang Chen
Department of Electrical and Computer Engineering
Michigan State University
East Lansing, Michigan
Lu-An Chen
Department of Materials Science and Engineering
National Chiao Tung University
Hsinchu, Taiwan
Waileong Chen
Institute of Microelectronics
National Cheng Kung University
Tainan, Taiwan
Xuyuan Chen
Department of Micro and Nano Systems Technology
HiVe—Vestfold University College
Tønsberg, Norway
Zuojing Chen
Department of Electrical and Computer Engineering
University of Massachusetts
Amherst, Massachusetts
Malgorzata Chrzanowska-Jeske
Department of Electrical and Computer Engineering
Portland State University
Portland, Oregon
Sorin Cotofana
Computer Engineering Laboratory
Delft University of Technology
CD Delft, the Netherlands
György Csaba
Department of Electrical Engineering
University of Notre Dame
Notre Dame, Indiana
Alessandro Giuseppe D’Aloia
Department of Astronautics, Electrical and Energetical Engineering (DIAEE)
and
Research Center for Nanotechnology Applied to Engineering (CNIS)
Sapienza University of Rome
Rome, Italy
Nitzan Dar
Department of Material Science and Engineering
National Cheng Kung University
Tainan, Taiwan
Jayita Das
Department of Electrical Engineering
University of South Florida
Tampa, Florida
P. P. Das
School of Electronics and Computing Systems
University of Cincinnati
Cincinnati, Ohio
Giovanni De Bellis
Department of Astronautics, Electrical and Energetical Engineering (DIAEE)
and
Research Center for Nanotechnology Applied to Engineering (CNIS)
Sapienza University of Rome
Rome, Italy
Alberto Delgado
Department of Electronic and Electrical Engineering
National University of Colombia at Bogota
Bogota, Colombia
José G. Delgado-Frias
School of Electrical Engineering and Computer Science
Washington State University
Pullman, Washington
Jaber Derakhshandeh
Delft Institute of Microsystems and Nanoelectronics
Delft University of Technology
CT Delft, the Netherlands
Eugene Edwards
U.S. Army
Redstone Arsenal, Alabama
Irina Eichwald
Lehrstuhl für Technische Elektronik
Technische Universität München
Munich, Germany
David R. Evans
Department of Physics
Portland State University
Portland, Oregon
Alexander Eychmüller
Technische Universität Dresden
Physical Chemistry and Electrochemistry
Dresden, Germany
Bernhard Fabel
Institute for Nanoelectronics
Technische Universität München
Munich, Germany
Melodie A. Fickenscher
Department of Physics
University of Cincinnati
Cincinnati, Ohio
Qiang Gao
Department of Electronic Materials Engineering
The Australian National University
Canberra, Australia
Morteza Gharib
California Institute of Technology
Pasadena, California
Avik W. Ghosh
Charles L. Brown Department of Electrical and Computer Engineering
University of Virginia
Charlottesville, Virginia
Qingqing Gong
Institute for Nanoelectronics
Technische Universität München
Munich, Germany
Stephen M. Goodnick
School of Electrical, Computer and Energy Engineering
Arizona State University
Tempe, Arizona
Matthias Graf
Department of Electronics Packaging Laboratory
Technische Universität Dresden
Dresden, Germany
Mélanie Guittet
Graduate Aeronautical Laboratories
California Institute of Technology
Pasadena, California
Yanan Guo
Materials Engineering and Centre for Microscopy and Microanalysis
University of Queensland
Queensland, Australia
Anurag Gupta
Department of Electrical and Computer Engineering
University of Alabama
Tuscaloosa, Alabama
Einar Halvorsen
Department of Micro and Nano Systems Technology
HiVe—Vestfold University College
Tønsberg, Norway
Ulrik Hanke
Department of Micro and Nano Systems Technology
HiVe—Vestfold University College
Tønsberg, Norway
Rikizo Hatakeyama
Department of Electronic Engineering
Tohoku University
Sendai, Japan
Andreas Hochmeister
Institute for Nanoelectronics
Technische Universität München
Munich, Germany
Nils Hoivik
Department of Micro and Nano Systems Technology
HiVe—Vestfold University College
Tønsberg, Norway
Loyd R. Hook IV
Department of Electrical and Computer Engineering
University of Oklahoma
Norman, Oklahoma
Arif Hossain
School of Electrical, Computer and Energy Engineering
Arizona State University
Tempe, Arizona
Po-Chun Huang
Department of Materials Science and Engineering
National Chiao Tung University
Hsinchu, Taiwan
Hasina F. Huq
Department of Electrical Engineering
The University of Texas-Pan American
Edinburg, Texas
Walid Ibrahim
College of Information Technology
United Arab Emirates University
Al Ain, United Arab Emirates
Kazuki Ihara
Technology Research Association for Single Wall Carbon Nanotubes (TASC)
and
NEC Corporation
Tsukuba, Japan
Ryoichi Ishihara
Delft Institute of Microsystems and Nanoelectronics
Delft University of Technology
Delft, the Netherlands
Mitsuki Ito
Department of Electrical and Electronic Engineering
Tokyo University of Agriculture and Technology
Tokyo, Japan
Jun-Ichi Iwata
Department of Applied Physics
The University of Tokyo
Tokyo, Japan
Howard E. Jackson
Department of Physics
University of Cincinnati
Cincinnati, Ohio
Chennupati Jagadish
Department of Electronic Materials Engineering
The Australian National University
Canberra, Australia
Gunther Jegert
Institute for Nanoelectronics
Technische Universität München
Munich, Germany
Yoon-Ha Jeong
The Department of Electrical Engineering, POSTECH
University of Science and Technology
Pohang, Republic of Korea
Hannah J. Joyce
Department of Physics
University of Oxford
Oxford, United Kingdom
Xueming Ju
Lehrstuhl für Nanoelektronik
Technische Universität München
Munich, Germany
Pilin Junsangsri
Department of Electrical and Computer Engineering
Northeastern University
Boston, Massachusetts
Karol Kalna
College of Engineering
Swansea University
Wales, United Kingdom
Jung-Hyun Kang
Department of Electronic Materials Engineering
The Australian National University
Canberra, Australia
P. Santosh Kumar Karre
Intel Corporation
Hillsboro, Oregon
Toshiaki Kato
Department of Electronic Engineering
Tohoku University
Sendai, Japan
Mrunal A. Khaderbad
Department of Electrical Engineering
IIT Bombay
Mumbai, India
Josef Kiermaier
Lehrstuhl für Technische Elektronik
Technische Universität München
Munich, Germany
Bruce C. Kim
Department of Electrical and Computer Engineering
University of Alabama-Tuscaloosa
Tuscaloosa, Alabama
Dae Mann Kim
National Center for Nanomaterials Technology
Pohang, Republic of Korea
Dong-Won Kim
Samsung Electronics
Republic of Korea
Ki Kang Kim
Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology
Cambridge, Massachusetts
Seong-Wan Kim
Quantum Intellectual Property Services
Austin, Texas
Ye-Ram Kim
The Department of Electrical Engineering, POSTECH
University of Science and Technology
Pohang, Republic of Korea
Yong Kim
Department of Physics
Dong-A University
Busan, Korea
Hagen Klauk
Max Planck Institute for Solid State Research
Stuttgart, Germany
Gregor Koblmüller
Walter Schottky Institute
Technische Universität München
Garching, Germany
Jing Kong
Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology
Cambridge, Massachusetts
Sambhav Kundaikar
Department of Electrical and Computer Engineering
Missouri University of Science and Technology
Rolla, Missouri
Shinya Kyogoku
Department of Applied Physics
The University of Tokyo
Tokyo, Japan
King Wai Chiu Lai
Department of Mechanical and Biomedical Engineering
City University of Hong Kong
Kowloon, Hong Kong
Donghwan Lee
Department of Chemistry and Research Institute for Natural Science
Hanyang University
Seoul, Korea
Jeong-Soo Lee
The Department of Electrical Engineering, POSTECH
University of Science and Technology
Pohang, Republic of Korea
Jongtaek Lee
Department of Chemistry and Research Institute for Natural Science
Hanyang University
Seoul, Korea
Kuo-Hao Lee
Department of Material Science and Engineering
National Cheng Kung University
Tainan, Taiwan
Jungwoo Lee
LG Chem
Daejeon, Korea
Samuel C. Lee
Department of Electrical and Computer Engineering
University of Oklahoma
Norman, Oklahoma
Sang-Hyun Lee
The Department of Electrical Engineering, POSTECH
University of Science and Technology
Pohang, Republic of Korea
Kevin Leedy
Air Force Research Laboratory
Wright Patterson AFB, Ohio
Nan Lei
School of Engineering and Computer Science
Washington State University
Vancouver, Washington
Dawen Li
Department of Electrical and Computer Engineering
University of Alabama-Tuscaloosa
Tuscaloosa, Alabama
Gang Li
Department of Micro and Nano Systems Technology
HiVe—Vestfold University College
Tønsberg, Norway
Pengfei Li
School of Engineering and Computer Science
Washington State University
Vancouver, Washington
Yiming Li
Department of Electrical and Computer Engineering
National Chiao Tung University
Hsinchu, Taiwan
Keng-Chih Liang
Department of Electro-Optical Engineering
National Cheng Kung University
Tainan, Taiwan
Carmen Maria Lilley
Department of Mechanical and Industrial Engineering
University of Illinois at Chicago
Chicago, Illinois
E. Linn
Institute of Materials in Electrical Engineering and Information Technology II (IWE II)
RWTH Aachen University
and
Jülich-Aachen Research Alliance (JARA) – Fundamentals for Future Information Technology
Aachen, Germany
Chih-Yi Liu
Department of Electro-Optical Engineering
National Cheng Kung University
Tainan, Taiwan
Chuan-Pu Liu
Department of Materials Science and Engineering
National Cheng Kung University
Tainan, Taiwan
Guanxiong Liu
Department of Electrical Engineering and Materials Science and Engineering Program
University of California
Riverside, California
Fabrizio Lombardi
Department of Electrical and Computer Engineering
Northeastern University
Boston, Massachusetts
Paolo Lugli
Institute for Nanoelectronics
Technische Universität München
Munich, Germany
Elham Maghsoudi
Department of Mechanical Engineering
Louisiana State University
Baton Rouge, Louisiana
Y. Malhotra
Department of Physics and Astrophysics
University of Delhi
Delhi, India
Michael James Martin
Department of Mechanical Engineering
Louisiana State University
Baton Rouge, Louisiana
Antonio Martinez
College of Engineering
Swansea University
Wales, United Kingdom
S. Menzel
Institute of Materials in Electrical Engineering and Information Technology II (IWE II)
RWTH Aachen University
and
JARA Jülich-Aachen Research Alliance–Fundamentals for Future Information Technology
Aachen, Germany
Munawar Ali Munawar
Institute of Chemistry
University of the Punjab
Lahore, Pakistan
Kamaram Munira
Charles L. Brown Department of Electrical and Computer Engineering
University of Virginia
Charlottesville, Virginia
Azad Naeemi
School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta, Georgia
Siva G. Narendra
Tyfone, Inc.
Portland, Oregon
Osama M. Nayfeh
U.S. Army Research Laboratory
and
University of Illinois
Urbana-Champaign, Illinois
R. S. Newrock
Department of Physics
University of Cincinnati
Cincinnati, Ohio
Poh Keong Ng
Department of Electrical and Computer Engineering
University of Illinois at Chicago
Chicago, Illinois
Mohammed Niamat
Department of Electrical Engineering and Computer Science
University of Toledo
Toledo, Ohio
Yung-Tang Nien
Center for Micro/Nano Science and Technology
National Cheng Kung University
Tainan, Taiwan
Fumiyuki Nihey
Technology Research Association for Single Wall Carbon Nanotubes (TASC)
and
NEC Corporation
Tsukuba, Japan
Michael L. Norton
Department of Chemistry
Marshall University
Huntington, West Virginia
Hideaki Numata
Technology Research Association for Single Wall Carbon Nanotubes (TASC)
and
NEC Corporation
Tsukuba, Japan
Yosuke Osanai
Department of Electronic Engineering
Tohoku University
Sendai, Japan
Atsushi Oshiyama
Department of Applied Physics
The University of Tokyo
Tokyo, Japan
Marco Ottavi
Department of Electronic Engineering
University of Rome “Tor Vergata”
Rome, Italy
Eunkyung Park
LG Hausys
Gyeonggi-do, Korea
Taehee Park
Department of Chemistry and Research Institute for Natural Science
Hanyang University
Seoul, Korea
Paul Plachinda
Department of Physics
Portland State University
Portland, Oregon
Eric Polizzi
Department of Electrical and Computer Engineering
University of Massachusetts
Amherst, Massachusetts
Salvatore Pontarelli
Department of Electronic Engineering
University of Rome “Tor Vergata”
Rome, Italy
Wolfgang Porod
Department of Electrical Engineering and Center for NanoScience and Technology
University of Notre Dame
Notre Dame, Indiana
Javier Pulecio
Brookhaven National Laboratory
Upton, New York
Masudur Rahman
Department of Chemistry
Marshall University
Huntington, West Virginia
P. Markondeya Raj
Packaging Research Center
Georgia Institute of Technology
Atlanta, Georgia
Shaloo Rakheja
School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta, Georgia
Katerina Raleva
University “Ss Cyril and Methodius” Skopje
Skopje, Macedonia
Shankar B. Rananavare
Department of Chemistry
Portland State University
Portland, Oregon
V. Ramgopal Rao
Department of Electrical Engineering
IIT Bombay
Mumbai, India
Alejandro Rodriguez
The University of Texas-Pan American
Edinburg, Texas
R. Rosezin
Peter Grünberg Institut
ForschungszentrumJülich GmbH
and
JARA Jülich-Aachen Research Alliance–Fundamentals for Future Information Technology
Jülich, Germany
Antonio Rubio
Department of Electronic Engineering
UniversitatPolitècnica de Catalunya
Catalonia, Spain
Paul Ruffin
U.S. Army
RDECOM/AMRDEC
Redstone Arsenal, Alabama
Takeshi Saito
National Institute of Advanced Industrial Science and Technology (AIST)
and
Technology Research Association for Single Wall Carbon Nanotubes (TASC)
Tsukuba, Japan
Adelio Salsano
Department of Electronic Engineering
University of Rome “Tor Vergata”
Rome, Italy
Fabrizio Sarasini
Department of Chemical Engineering Materials Environment (DICMA)
Sapienza University of Rome
Rome, Italy
Sudeep Sarkar
Department of Computer Science and Engineering
University of South Florida
Tampa, Florida
Maria Sabrina Sarto
Department of Astronautics, Electrical and Energetical Engineering (DIAEE)
and
Research Center for Nanotechnology Applied to Engineering (CNIS)
Sapienza University of Rome
Rome, Italy
Muhammad Hassan Sayyad
GIK Institute of Engineering Sciences and Technology
Topi, Pakistan
Giuseppe Scarpa
Institute for Nanoelectronics
Technische Universität München
Munich, Germany
Hugo Schellevis
Delft Institute of Microsystems and Nanoelectronics
Delft University of Technology,
Delft, the Netherlands
Doris Schmitt-Landsiedel
Lehrstuhl für Technische Elektronik
Technische Universität München
Munich, Germany
Reza Shahbazian-Yassar
Department of Mechanical Engineering
Michigan Technological University
Houghton, Michigan
Muhammad Shahid
Institute of Chemistry
University of the Punjab
Lahore, Pakistan
Himani Sharma
Packaging Research Center
Georgia Institute of Technology
Atlanta, Georgia
Jeng-Tzong Sheu
Institute of Nanotechnology/Department of Materials Science and Engineering
National Chiao Tung University
Hsinchu, Taiwan
Jun-Ichi Shirakashi
Department of Electrical and Electronic Engineering
Tokyo University of Agriculture and Technology
Tokyo, Japan
Leigh M. Smith
Department of Physics
University of Cincinnati
Cincinnati, Ohio
William A. Soffa
Department of Materials Science and Engineering
University of Virginia
Charlottesville, Virginia
Raj Solanki
Department of Physics
Portland State University
Portland, Oregon
Purushothaman Srinivasan
Texas Instruments
Dallas, Texas
A. Srivastava
Electronics and Communication Engineering
Indian Institute for Information Technology-Design and Manufacturing
Jabalpur, India
Eric A. Stinaff
Department of Physics and Astronomy
Ohio University
Athens, Ohio
Kurt Stokbro
QuantumWise A/S
Copenhagen, Denmark
Anand Subramaniam
Department of Electrical Engineering
University of Texas at Dallas
Richardson, Texas
Ryutaro Suda
Department of Electrical and Electronic Engineering
Tokyo University of Agriculture and Technology
Tokyo, Japan
Khaulah Sulaiman
Low Dimensional Materials Research Center (LDMRC)
University of Malaya
Kuala Lumpur, Malaysia
Mawahib Hussein Sulieman
United Arab Emirates University
Abu Dhabi, United Arab Emirates
Anirudha V. Sumant
Center for Nanoscale Materials
Argonne National Laboratory
DuPage County, Illinois
Earl E. Swartzlander Jr.
Department of Electrical and Computer Engineering
University of Texas at Austin
Austin, Texas
Bao Quoc Ta
Department of Micro and Nano Systems Technology
HiVe—Vestfold University College
Tønsberg, Norway
Mihai Tache
United Arab Emirates University
Abu Dhabi, United Arab Emirates
Alessio Tamburrano
Department of Astronautics, Electrical and Energetical Engineering (DIAEE)
and
Research Center for Nanotechnology Applied to Engineering (CNIS)
Sapienza University of Rome
Rome, Italy
Hark Hoe Tan
Department of Electronic Materials Engineering
The Australian National University
Canberra, Australia
Jesus Torres
The University of Texas—Pan American
Edinburg, Texas
Hoang A. Tran
Department of Chemistry
Portland State University
Portland, Oregon
Jacopo Tirillò
Department of Chemical Engineering Materials Environment (DICMA)
Sapienza University of Rome
Rome, Italy
Chia-Hao Tu
Department of Materials Science and Engineering
National Cheng Kung University
Tainan, Taiwan
Rao Tummala
Packaging Research Center
Georgia Institute of Technology
Atlanta, Georgia
Yonhua Tzeng
Institute of Microelectronics and Advanced Optoelectronics Technology Center
National Cheng Kung University
Tainan, Taiwan
Johan van der Cingel
Delft Institute of Microsystems and Nanoelectronics
Delft University of Technology
Delft, the Netherlands
Edit Varga
Department of Electrical Engineering and Center for Nano Science and Technology
University of Notre Dame
Notre Dame, Indiana
Dragica Vasileska
School of Electrical, Computer and Energy Engineering
Arizona State University
Tempe, Arizona
Srinivasa Vemuru
Department of Electrical and Computer Engineering and Computer Science
Ohio Northern University
Ada, Ohio
Eric M. Vogel
Department of Electrical Engineering
University of Texas at Dallas
Richardson, Texas
Sten Vollebregt
Delft Institute of Microsystems and Nanoelectronics
Delft University of Technology
Delft, the Netherlands
Fazal Wahab
GIK Institute of Engineering Sciences and Technology
Topi, Pakistan
J. Wan
School of Electronics and Computing Systems
University of Cincinnati
Cincinnati, Ohio
Peng Wang
Department of Electrical Engineering and Computer Science
University of Toledo
Toledo, Ohio
Wen-Jing Wang
Department of Material Science and Engineering
National Cheng Kung University
Tainan, Taiwan
Yushu Wang
Packaging Research Center
Georgia Institute of Technology
Atlanta, Georgia
R. Waser
Institute of Materials in Electrical Engineering and Information Technology II (IWE II)
RWTH Aachen University
Aachen, Germany
and
Peter Grünberg Institut
Forschungszentrum Jülich GmbH,
and
The JARA Jülich-Aachen Research Alliance—Fundamentals for Future Information Technology
Jülich, Germany
Kushal C. Wijesundara
Department of Physics and Astronomy
Ohio University
Athens, Ohio
Gilson Wirth
Department of Electrical Engineering
Universidade Federal do Rio Grande do Sul (UFRGS)
Porto Alegre, Brazil
David Wolpert
IBM
Poughkeepsie, New York
Klaus-Jürgen Wolter
Electronics Packaging Laboratory
Technische Universität Dresden
Dresden, Germany
Ning Xi
Department of Electrical and Computer Engineering
Michigan State University
East Lansing, Michigan
Hongyi Xu
Department of Materials Engineering
University of Queensland
Queensland, Australia
Jie Xu
Department of Mechanical Engineering
Washington State University
Vancouver, Washington
Wei Xue
Department of Mechanical Engineering
Washington State University
Vancouver, Washington
Jan M. Yarrison-Rice
Department of Physics
Miami University
Oxford, Ohio
Whikun Yi
Department of Chemistry and Research Institute for Natural Science
Hanyang University
Seoul, Korea
Sigfrid Yngvesson
Department of Electrical and Computer Engineering
University of Massachusetts—Amherst
Amherst, Massachusetts
Jie Yu
Department of Electrical Engineering and Materials Science and Engineering Program
University of California
Riverside, California
Maciej Zawodniok
Department of Electrical and Computer Engineering
Missouri University of Science and Technology
Rolla, Missouri
Liren Zhang
College of Information Technology
United Arab Emirates University
Al Ain, United Arab Emirates
Zhe Zhang
School of Electrical Engineering and Computer Science
Washington State University
Pullman, Washington
Jin Zou
Department of Materials Engineering
University of Queensland
Queensland, Australia
Ute Zschieschang
Max Planck Institute for Solid State Research
Stuttgart, Germany