M.O. Alam and C. Bailey [email protected],     School of Computing and Mathematical Science, University of Greenwich, Old Royal Naval College, Park Road, London, SE10 9LS, UK. E-mail address: [email protected]

J. Felba,     Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, ul. Janiszewskiego 11/17, 50-372 Wrocław, Poland. E-mail address: [email protected]

J.W.C. de Vries and J.F.J.M. Caers [email protected],     Philips Applied Technologies, High Tech Campus 7, 5656AE Eindhoven, The Netherlands. E-mail address: [email protected]

J.E. Morris,     Department of Electrical & Computer Engineering, Portland State University, P.O. Box 751, Portland, OR 97207-0751,USA. E-mail address: [email protected]

Q.K. Tong,     Henkel Corporation, 10 Finderne Avenue, Bridgewater, NJ 08807,USA. E-mail address: [email protected]

M. Inoue,     The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan. E-mail address: [email protected]

C. Bailey,     School of Computing and Mathematical Science, University of Greenwich, Old Royal Naval College, Park Road, London, SE10 9LS, UK. E-mail address: [email protected]

M.A. Uddin and H.P. Chan,     Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong. E-mail address: [email protected]