Acacia Communications, 14, 15, 59, 70, 70–71, 86

coherent transceivers, 75–77, 76f, 78, 79t

single-chip transceiver, 106

Access network, 26f, 27, 124

Active Optical Cables (AOC), 69, 72–73, 152

ADVA Optical Networking, 104, 104, 105f, 111

AIM Photonics, 14, 170f, 174–175, 175, 175

Alcatel-Lucent, See Nokia

Amazon, 22–23, 88f, 93–94, 119, 120f

Web Services, 121, 121–122, 122, 122, 122f

Apple, 93–94, 119, 120f, 122

Applied Optoelectronics, 84

ARM Holdings, 94

Arthur, W. Brian, 65, 65, 65, 65, 65

Asghari, Mehdi, 41, 41, 153, 153, 155

AT&T, 34, 93, 123, 123–124, 124, 124

Attenuation characteristics of fiber, 186–187, 186f

Aurrion, 68f, 70–71, 88f, 174, 174, 175

Ayar Labs, 160

Backplane, 32–33, 33, 148

Bergman, Keren, 133, 143, 143, 144, 144, 144, 159

BiCMOS, 51–52

Big Data, 22–23, 167

BinOptics, 70

Booth, Brad, 107, 107, 108, 155–156

Bowers, John, 2, 4, 53, 167, 175

Broadcom, 142, 156

BT, 110, 197

Caliopa, 68f, 70

Car, 22–23

CenturyLink, 123

CFP, 75, 77, 78, 85, 169, 189, 189f

CFP2, 71, 73–74, 74, 74, 74, 78, 86, 106–107, 109, 189, 189f

CFP2-ACO, 104, 104, 105, 106, 106, 106–107, 169

CFP4, 78, 189, 189f

CFP8, 189, 189f

CFP8-ACO, 106–107, 169, 170f, 189

China Mobile, 93

Chip(s), 33–34, 34f

fibering, 59–62, 60f, 61f, 61f, 62t

industry, 41–47, 44f

future of, 45–47, 175–177

silicon photonics owned by, 175–177, 176f

Ciena, 12, 68f, 70–71, 86, 105f, 106

WaveLogic Ai, 198

Waveserver, 103, 103–104, 110

Cisco Systems, 12, 15, 34, 59, 69, 70, 80–81, 84, 86, 106, 181f

CPAK, 68f, 70, 73–75, 75f, 78, 79t

disaggregated server, 147

NCS 1002, 102–103, 103, 103f, 104, 198

NCS 2015 chassis, 102–103, 103, 103f

Nexus 7700 switch rack, 32f

ClariPhy, 86

Cloud, as an information resource, 22–23

Cloud computing, 27–28, 121–125

CloudConnect, 104, 104, 105f

Cloud Xpress 2, 103–105, 105, 105f, 106

Cloud Xpress platform, 102, 103–105, 105f

CLR4, 71, 84, 85, 150, 169, 184

Coarse wavelength-division multiplexing (CWDM), 180

Coherent (DSP ASIC), 77, 78, 86, 103, 103–104, 104, 105, 108

Coherent transceivers, 75–77, 76f, 78, 79t
See also CFP2-ACO, CFP8-ACO, Consortium of On-Board Optics (COBO)

Collings, Brandon, 119

Colorchip, 84

Columbia University, 143

Communications networks, layers and evolution of, 21

Communications service providers (CSPs), 93, 95
See also Telcos

capital expenditure forecast, 95f

revenue forecast, 94f

Compass Electro Optical Systems (Compass-EOS), 145, 147–149, 159

Complementary metal-oxide semiconductor (CMOS), 2, 2–3, 3, 3, 3–4, 4, 4, 9–10, 11, 42, 43, 43, 43, 44, 44, 44f, 49, 151, 156, 165

Consortium of On-Board Optics (COBO), 108, 154–155, 170f, 171, 171

Copackaged optics, 156–160, 158f, 170f

Copper, 4, 4–5, 5, 5–6, 10, 18, 27, 29, 30–31, 31, 31, 33–34, 37, 48, 141, 146–147, 147, 151–152, 152, 152, 157–158, 183

CORD, 124

Coriant, 106

Groove G30, 104, 105, 105f, 106

Cornell University, 67

Corning, 145

Cost-per-transmitted-bit, 99–101, 100f

CPAK, 73–75, 75f, 78, 79t

Cultural divide, 173–175

CWDM4, 71, 84, 85, 146, 150, 169, 182, 182f, 184, 184, 185

Data center (Layer 3), 29–31, 30f

as opportunity for silicon photonics, 30–31

Data center interconnect, 105–109, 105f, 106, 115

Data centers, 119, 130

adding photonics to ultralarge-scale chips, 160–163, 162f

challenges addressed by silicon photonics, 130

cloud computing, 121–125

embedding optics to benefit systems, 142–149

Compass Electro Optical Systems, 147–149

electronic-optic switch architecture for large data centers, 143–145

Intel’s disaggregated server Rack Scale Architecture, 145–147, 146f

energy consumption, 128–129, 129f

expansive build-out of, 125–128

higher-order radix switches, 142, 143f

input–output challenges, 149–160, 149f

100-Gb transceivers, 150–151

copackaged optics, 156–160, 158f

on-board optics, 152–156, 153f

single-mode fiber, 151

top-of-row switch optical opportunity, 151–152

interconnect

equipment, 101–105, 105f

new requirements and new optical platform form factors, 102–103

silicon photonics, role of, 105–109, 107–109

leaf-and-spine switching architecture, 138–142, 139f, 139f, 140f, 140t

silicon photonics, architectures and opportunities for, 133

video adds to bandwidth pressures, demand for, 125–126

Datacom industry, challenges associated with, 34–37

De Dobbelaere, Peter, 155, 156, 156–157

Dell

disaggregated server, 147

Dense wavelength-division multiplexing (DWDM), 26–27, 28, 31, 97, 99, 107–108, 108, 180, 185, 188, 188–189, 191

Deutsche Telekom, 93

Digital Realty, 124

Disaggregated servers, 10, 11f, 11f, 123, 145–147, 146f, 164–165

Disruptive technology, 1, 175, 177

Doerr, Chris, 7–8

Drone, 23

DSP-ASICs, 103, 103–104, 104, 105, 105, 107, 108

Edge coupling, 60

Electroabsorption modulators, 56, 56t

ElectroniCast, 82

Electronic-optic switch architecture, for large data centers, 143–145

Energy consumption, of data centers, 128–129, 129f

Energy demand, 130

Equinix, 124

Ericsson, 32–33, 33, 147

Ethernet, 33, 69, 75, 80, 86–87, 89–90, 142, 142, 171, 172, 182, 188, 189

Ethernet Alliance, 153, 153f

EZchip, 48

Facebook, 22–23, 28, 93–94, 119, 119–120, 125f

data center builds, 126–128, 127f, 128f

growth in daily video views, 119, 125

leaf-and-spine switching architecture, 140, 140f

Open Compute Project, 37

Fiber

attenuation characteristics of, 186–187, 186f

bands, 111, 112t

Fibering the chip, 59–62, 60f

Field-programable gate arrays (FPGAs), 159

Finisar, 69, 184

5G, 172

Fixed Communication Service Provider (CSP) capital expenditure forecast, 95f

Fixed Communication Service Provider (CSP) revenue forecast, 94f

Flexible grid, 109–110, 110f

Flexible-rate transponders, 110–111

40-Gb AOC, 72–73, 78, 79t

400-Gb Ethernet, 86–87, 182

Fraunhofer Heinrich Hertz Institute, 83

Freescale, 80–81

Fujitsu Optical Components, 84, 86

Gallium arsenide, 3, 4, 5, 6, 18, 49, 50, 50–51, 52, 168, 168, 176, 184

Gazzaniga, Michael S., 21

GlobalFoundries, 6

Google, 22–23, 28, 93–94, 119, 119–120

cloud business growth, seeking, 122–123

Graphics processing unit (GPU), 159

Grating coupling, 60–61, 61f

Greenpeace, 128, 129, 130

Grove, Andrew S., 167

Hasharoni, Kobi, 148, 148

HBT (Heterojunction Bipolar Transistor), 51–52

HEMT (High Electron Mobility Transistor), 51–52

Heterogeneous integration, 53, 53, 53, 57, 58, 59

Hewlett-Packard (HP), 69, 81–82

Higher-order modulation, 196–197

lever-boosted transmission capacity, 197–200, 198f, 199f, 200f

Higher-order radix switches, 142, 143f

History of silicon photonics, 67–71

Hochberg, Michael, 65

Huawei, 12, 70, 86, 106

Hybrid cloud model, 124–125

Hybrid integration, 52

IBM, 9–10, 15, 45, 46, 69, 70, 81–82, 123

Imec, 43

Indium phosphide, 3, 4, 5, 6, 7–8, 8, 18, 18, 49, 50, 50–51, 52, 53, 56, 57, 58, 58, 73, 73, 74–75, 78, 78, 78, 84, 84–85, 85, 86–87, 96, 106, 106, 106, 106, 111, 114, 115, 115, 150–151, 155, 168, 168, 176, 184

Infinera, 86, 104, 105, 106, 106

InnoLight, 84

InPhi, 108, 108, 109, 109, 169–171

Integrated circuit, 2, 7–8, 42, 46, 51, 158f

building blocks, 52–62

Intel, 59, 69, 70, 80–81, 81–82, 123, 176

disaggregated server Rack Scale Architecture, 145–147, 146f

Interconnect technologies, 18, 146–147

Internal replacement, 65, 65–66

International Technology Roadmap for Semiconductors (ITRS), 44, 45

Internet businesses

challenges associated with, 36–37

fastest network traffic growth of, 97–99

Internet content providers (ICP), 22–23, 36, 36, 37, 39, 115, 119–121, 120f, 130

capital expenditure forecast, 95f

new drivers of photonics, 135–136

revenue forecast, 94f

Internet of Things, 12, 23, 94, 172–173

Interposer, 157, 157–158, 158, 158, 158, 158f, 159, 159, 160

IP core router, 147, 147

ITRS 2.0, 45, 46t

Jobs, Steve, 41

Juniper Networks, 12, 15, 59, 70–71, 174

Kaiam, 15

Kimerling, Lionel, 21, 41, 133, 159, 175, 175

Kotura, 69, 71

variable optical attenuator, 71–72, 72f, 78, 79t

Kozlov, Vladimir, 1

Lab on a chip, 12

Layer 1, 5f, 25, 25f, 33–34, 37–38

Layer 2, 5f, 25f, 31–33, 37–38

Layer 3, 5f, 25f, 29–31, 89, 188

Layer 4, 5f, 25, 25–29, 25f, 28, 31, 35, 37, 38, 71, 89, 102, 115

optical transmission techniques for, 191

telecom network trends, 115

Layering, 24–25, 25f

Leaf-and-spine switching architecture, 138–142, 139f, 139f, 140f, 140t

Leaf-spine switching architecture, 164

Light Detection and Ranging (LIDAR), 16–17, 172–173

Light source, 57–59, 58f

impact on overall cost and optical performance, 59t

LightCounting, 83, 168, 168, 168, 168

Lightwire, 69

Lithium niobate, 8, 49, 50, 50–51, 176, 185

Liu, Karen, 93

Local area network wavelength-division multiplexing (LAN WDM), 185

Long-distance optics, 185

Long-haul networks, 26–27

Long-reach optics, 185

Lumentum, 71, 84, 86

Luxtera, 9–10, 15, 59, 69

40-Gb AOC, 72–73, 78, 79t

100-Gb PSM4 silicon photonics chip, 74f, 137f

on-board optics, 155

Mach–Zehnder modulators, 55, 55, 56t

Macom, 15, 70, 71

Madison, 109, 169

Madison 1.0, 108

Madison 1.5, 108, 169–171

Madison 2.0, 108, 171

Market opportunities, for silicon photonics, 168–173

mid-term opportunities, 172–173

near-term opportunities, 169–172, 170f

Medical devices, 16–17, 18, 172–173

Mellanox Technologies, 12, 15, 48, 69

on-board optics, 152, 153, 155

variable optical attenuator, 71–72, 72f, 78, 79t

Memory, 10, 11f, 48, 145, 159, 161–163, 163

Metro networks, 27

Microprocessor, 11, 28, 33, 47, 161, 162f, 163, 163

μQSFP, 153, 154, 156, 171

Microsoft, 93–94, 107, 107, 107, 108, 109, 119

Azure, 122, 122

cloud business growth, seeking, 122–123

Consortium of On-Board Optics (COBO), 108

data center builds, 126

hybrid cloud model, 124–125

Internet Explorer, 167

Madison 1.0, 108

Madison 1.5, 108

Madison 2.0, 108

Madison module requirements, 169, 169–171

single-mode fiber, 151, 151

Microwave photonics, 12, 16–17, 18, 177

Mid-reach optics, 184

Miniaturization of modules, 188–189

Mobile Communication Service Provider (CSP) capital expenditure forecast, 95f

Mobile Communication Service Provider (CSP) revenue forecast, 94f

Modulation, 55–56

Modulation Schemes, 76–77, 104, 110, 187, 195, 196, 197

DQPSK, 195

duobinary, 195

nonreturn to zero, 153, 153–154, 154

on-off keying, 187, 192

PAM4, 108, 150–151, 153, 153–154, 154, 156–157, 169–171, 171

PM-3QAM, 197, 197

PM-8QAM, 197

PM-16QAM, 197, 198, 200

PM-32QAM, 197

PM-64QAM, 200

PM-BPSK, 197

PM-QPSK, 195, 195–196, 196, 197, 198, 199

QPSK, 195

Modulator, 50, 53

Molex, 69, 73, 84

Monolithic integration, 52

Moore, Gordon E., 2–3, 37, 41, 41, 42, 42, 42, 42, 42, 42, 43, 43, 45

Moore’s law, 2–3, 8–9, 9, 11, 18, 38, 41–47, 44f, 96, 175

end of, approaching, 37

More than Moore’s law, 38, 62

MSA (multisource agreement), 73, 84, 154, 169, 171, 181, 182, 188, 189, 189f

Multichip module, 157–158

Multicore chip architecture, 48, 48f

Multimode fiber, 136, 145, 146, 151, 151, 181, 182, 184, 184, 186

Multiple input, multiple output (MIMO), 113, 113

Multiplexing, 191, 192, 192, 193f

Multisource agreement (MSA), 73, 84, 154, 169, 171, 181, 182, 188, 189, 189f

MXC, 145, 146

Nature, 67–69, 161

NEL, 86

Network Processor, 33, 74, 74, 75, 147, 147, 148

Nokia, 86, 97–98, 104, 106, 111, 147

Bell Labs, 113, 113, 114, 172–173

Nonlinear Shannon limit, 98, 98, 98, 98f, 99, 111

Nortel Networks, 97

NTT, 93, 124

NXP, 80–81

Oclaro, 84

On-board optics, 152–156, 153f, 165

OpenOptics MSA, 84, 171

Optical channel, classes of, 192–194, 193f, 194f, 194t

Optical component technologies, 183–185

long-distance optics, 185

long-reach optics, 185

mid-reach optics, 184

short-reach links, 183–184

Optical links, 179–183

parallel, 181f

Optical modules, 187–189, 188t, 189f

miniaturization of modules, 188–189

Optical networking, 23, 24f

Optical technology, 1, 4, 5–6, 17, 18, 29, 39, 135, 155

Optical transceivers, 100-Gb, 74f, 83–87, 85f, 150–151

challenges associated with, 86

near-term data center opportunity, 84–85

silicon photonics, emerging opportunities for, 86–87

single-carrier, with coherent detection, 194–195

Optical transmission techniques, for Layer 4 Networks, 191–202

higher-order modulation, 196–197

optical channel, classes of, 192–194, 193f, 194f, 194t

single-carrier 100-Gb transmission with coherent detection, 194–195

spectral efficiency, improving, 195–196

Optical waveguide, 3–4, 6, 8, 48, 49, 50, 53–54, 54, 54–55, 54f, 74–75

Optics, 1

adapting silicon for, 49–50

for communications, importance of, 28–29

future of, 45–47

Oracle, 15, 32–33, 33, 69

Ovum, 82, 83–84, 100

PAM4, 108, 108, 109, 150–151, 153, 153, 153–154, 154

Paniccia, Mario, 1, 14, 67–69

Parallel fiber, 179

Performance edge, delivering, 78–79

Photodetectors, 53, 57

Photonic Controls, 70

Photonic integrated circuit (PIC), 7–8, 46, 52, 52, 53, 53–54, 77, 103, 158f, 169

Platforms (Layer 2), 31–33, 32f

Pluggable modules, 74, 78, 152, 154, 156, 160

CFP, 75, 77, 78, 85, 169, 189

CFP2, 71, 73–74, 74, 74, 106–107, 109, 189

CFP2-ACO, 104, 104, 105, 106, 106, 106–107, 169

CFP4, 78, 189

CFP8, 189

CFP8-ACO, 106–107, 169, 189

μQSFP, 153, 154, 156, 171

QSFP, 154

QSFP28, 71, 78, 108, 108, 108, 152, 152, 156, 169–171, 189

QSFP56, 156, 171

QSFP-DD, 153, 153–154, 156, 171

SFP, 154

SFP+, 188, 188, 188–189, 188t, 189, 189

X2, 188t

XENPAK, 188t

XFP, 188t

XPAK, 188t

PSM4, 71, 73, 73, 73, 74f, 78, 84, 85, 137f, 146, 150, 155, 169, 176, 181, 184, 184

QSFP, 154

QSFP28, 71, 78, 108, 108, 108, 146, 152, 152, 156, 169–171, 189

QSFP56, 156, 171

QSFP-DD, 153, 153–154, 156, 171

Qualcomm, 80–81

Reconfigurable add-drop multiplexers (ROADMs), 100, 101, 101, 102

Reed, Graham, 14, 14, 14

Regional networks, 27

Rickman, Andrew, 12, 12

Ring resonators, 56, 56t

Robinson, Kim Stanley, 167

Rockley Photonics, 12, 12, 169

Schmitt, Andrew, 93, 94–95

Semiconductor industry

building blocks, 50–52

integrated circuits, building blocks, 52–62

silicon photonics’ benefits to, 47–50

Sensor on a chip, 12

Serdes, 156, 156–157, 157, 157, 159

Servers, 10, 10, 10, 17, 22, 22, 22, 23, 27, 28, 29, 29, 30–31, 31, 31, 32–33, 36–37, 70, 102, 119, 122, 124, 124–125, 126, 128–129, 129, 130, 133, 133–134, 134, 135, 135, 137, 137, 138, 138, 138, 138, 138–139, 139, 139–140, 140, 140–141, 140–141, 141, 141, 141, 141, 141–142, 142, 142, 143, 144, 160, 163–164, 164, 164

disaggregated, 10, 11f, 123, 145–147, 146f, 164–165

Shaw Communications, 124–125

Short-reach links, 183–184

Shrinking transistor, 43–44

Sicoya, 160

Silicon, as an integration platform, 8, 8f

Silicon chip (Layer 1), 33–34, 34f

Silicon photonics, 1, 5f, 62, 89, 115, 167, 177

application of, 4–6, 18

benefits to semiconductor industry, 47–50

company acquisitions, 82t

cultural divide, 173–175

data center architectures and opportunities for, 133

data center challenges addressed by, 130

data center networking as opportunity for, 30–31, 37–39

direct detection opportunity for, 107–109

as disruptive technology, 17–18

ecosystem, 87–90

emerging opportunities for, 86–87

evolution of, 13f

history of, 67–71

industry disruption, 16–18, 175, 177

mainstream, 79–83

market opportunities for, 16–17, 168–173

mid-term opportunities, 172–173

near-term opportunities, 169–172, 170f

owned by chip industry, 175–177, 176f

from photonics perspective, 7–8

role in data center interconnect, 105–109

from semiconductor perspective, 8–10

significance of, 6–12

status of, 13–16, 15f

from system perspective, 10–12

venture capital funding for, 81–83, 81t

Silicon-on-insulator, 6, 49

Single-carrier 100-Gb transmission with coherent detection, 194–195

Single-channel transmission, 179

Single-mode fiber, 72–73, 73, 111, 112f, 113, 136, 136, 141, 148, 150, 151, 154–155, 182, 183, 184, 184, 185, 186

Softbank, 94

Soref, Richard, 12, 12, 12, 14, 51, 51f

Source Photonics, 84

Space-division multiplexing, 111–114, 112f, 115

Spectral efficiency, improving, 195–196

Start-ups, 81t

STMicroelectronics, 15, 18, 80–81, 158f, 176

Storage, 10, 10, 23, 25, 28, 29, 30–31, 33–34, 36–37, 70, 123, 138, 145, 165

Stojanovic, Vladimir, 161, 161, 163, 163

Sun Microsystems, 69

Superchips, 50–52, 51f, 53f

Switch fabric, 147–148, 148

System in package, 157–158, 160, 176–177

System on a chip, 12

System vendors, 17, 87, 90, 115

Technical University Berlin, 83

Technology adoption curve, 65–67

Technology development cycle, 66f, 68f

disillusion phase, 66–67

innovation phase, 66

peak phase, 66

productivity phase, 67

Telcos, 25, 26, 26, 27, 93, 93–94, 94

cloud computing, 123–124

Telecom industry, 130

challenges associated with, 34–37

changing nature of, 93–97

Telecom networks (Layer 4), 25–29, 26f

Telefonica, 110

Tencent

cloud business growth, seeking, 123, 123

Rack Scale Architecture, 123

Teraxion, 70–71

III-V compounds, 3, 50

T-Mobile, 95

Top-of-row switch optical opportunity, 151–152

Traffic growth, tackling, 109–114

fiber bands, 111, 112t

flexible grid, 109–110, 110f

flexible-rate transponders, 110–111

space-division multiplexing, 111–114, 112f

Traffic Manager, 147, 147–148, 148, 148

Traffic-carrying capacity of fiber, 35–36, 36f

TSMC, 6

University of California, Berkeley, 161

University of California, Davis, 48

University of California, Santa Barbara, 2, 67–69

University of Southampton, 14

US Conec, 145

Variable optical attenuator, 71–72, 72f, 78, 79t

Venture capital funding, 81–83, 81t

Verizon, 95, 123, 123, 123–124, 192

Vertical-cavity surface-emitting lasers (VCSELs), 5, 10, 12, 16–17, 18, 146–147, 148, 148, 148, 151, 183, 184, 184

Wavelength-division multiplexing, 180, 182f

WaveLogic Ai, 198

Waveserver, 103, 103–104, 110

Wide area networks (WAN), 23

Winzer, Peter, 113, 114

WolframAlpha, 21, 22, 22, 23, 133