Contributors

James E. Adams, Jr. Eastman Kodak Company, Rochester, New York, USA

Gonzalo R. Arce University of Delaware, Newark, Delaware, USA

Murat Birinci Tampere University of Technology, Tampere, Finland

Alan C. Bovik The University of Texas at Austin, Austin, Texas, USA

Santanu Chaudhury Indian Institute of Technology Delhi, New Delhi, India

Tsuhan Chen Cornell University, Ithaca, New York, USA

Aaron T. Deever Eastman Kodak Company, Rochester, New York, USA

Piotr Didyk MPI Informatik, Saarbrücken, Germany

Elmar Eisemann Telecom ParisTech (ENS) – CNRS (LTCI), Paris, France

Wei Feng Tianjin University, Tianjin, P. R. China

Moncef Gabbouj Tampere University of Technology, Tampere, Finland

Gonzalo J. Garateguy University of Delaware, Newark, Delaware, USA

Gaurav Harit Indian Institute of Technology Rajasthan, India

Lina Karam Arizona State University, Tempe, Arizona, USA

Serkan Kiranyaz Tampere University of Technology, Tampere, Finland

Stefanos Kollias National Technical University of Athens, Athens, Greece

Daniel L. Lau University of Kentucky, Lexington, Kentucky, USA

Congcong Li Cornell University, Ithaca, New York, USA

Shujun Li University of Surrey, Surrey, UK

Xin Li West Virginia University, Morgantown, West Virginia, USA

Zhouchen Lin Microsoft Research Asia, Beijing, P. R. China

Zhi-Qiang Liu City University of Hong Kong, Hong Kong, P. R. China

Rastislav Lukac Foveon, Inc. / Sigma Corp., San Jose, California, USA

Anush K. Moorthy The University of Texas at Austin, Austin, Texas, USA

Efraín O. Morales Eastman Kodak Company, Rochester, New York, USA

Phivos Mylonas National Technical University of Athens, Athens, Greece

Karol Myszkowski MPI Informatik, Saarbrücken, Germany

Haluk Öğmen University of Houston, Houston, Texas, USA

Bruce H. Pillman Eastman Kodak Company, Rochester, New York, USA

Tobias Ritschel Telecom ParisTech (ENS) – CNRS (LTCI), Paris, France

Nabil Sadaka Arizona State University, Tempe, Arizona, USA

Kalpana Seshadrinathan Intel Corporation, Santa Clara, California, USA

Evaggelos Spyrou National Technical University of Athens, Athens, Greece

Liang Wan Tianjin University, Tianjin, P. R. China

Stefan Winkler Advanced Digital Sciences Center, Singapore

Tien-Tsin Wong The Chinese University of Hong Kong, Hong Kong, P. R. China